On August 24, the annual event of Siemens EDA - 2023 Siemens EDA Forum kicked off in Pudong, Shanghai. This summit is the return of Siemens EDA after a three-year absence. The theme of the conference is "Accelerating Chip Creation, Leading the Future with Intelligence", focusing on hot topics such as AI applications, automotive chips, SoC, 3D IC and circuit board system technology. Share the latest technological achievements of Siemens EDA, and invite a number of industry experts, technology pioneers, and partners to gather together to discuss the development trend and technological innovation of the global semiconductor and integrated circuit (IC) industry.

As the cornerstone of the semiconductor industry, EDA, the most upstream in the industry chain, supports the huge semiconductor market. As the industry continues to move towards digitization and intelligence, EDA tools also play a key "leverage" role in the digital economy. Although the global economic downturn, downstream industry demand adjustments, and inventory correction cycles have continued in the past period of time, the EDA industry still shows the flexibility and resilience of stable development under the fluctuations of the industry cycle.

Ling Lin, global vice president and general manager of Siemens EDA China, said in the opening speech of the summit: "How to gain insight into market opportunities amidst changes and gain first-mover advantages in new business formats is the key for enterprises to strengthen their adaptability and achieve ultimate success. In the past 34 years since entering China, Siemens EDA has always focused on the word "needs", observing the situation with experience, solving the situation with technology, and breaking the situation with partners. We believe that we can proactively grasp the cyclical changes and help customers build in advance Next-generation electronic system design is the optimal solution to achieve coordinated development."

In the subsequent keynote speech of the conference, Peng Qihuang, global senior vice president and president of Asia Pacific of Siemens EDA, took the historical trend of semiconductors during the economic downturn as a mirror, and discussed the reasons for optimism in the new industry development cycle. Peng Qihuang said: "Although the semiconductor industry presents some uncertainties due to structural changes, the implementation of new technologies, the highlight of the value of semiconductors, and the increase in investment by enterprises and the government have all released positive signals of optimism. EDA tools are As the key technology to promote the development of semiconductors, Siemens EDA will continue to export technical capabilities and contribute to the high-quality development of the semiconductor industry.”
Talking about the strategic direction of Siemens EDA, Peng Qihuang shared that the decline of Moore's Law and the continuous expansion of chip scale require semiconductor companies to persist in innovation. In order to help customers meet challenges, Siemens EDA is committed to creating comprehensive EDA tools and services, fully empowering future-oriented solutions from chips to systems. With the support of artificial intelligence/machine learning (AI/ML) and cloud computing, Siemens EDA actively develops large-scale heterogeneous integrated 3D IC technology to help customers improve the quantity and quality of transistors; Digital circuit implementation process, advanced verification, and end-to-end test solutions; in the face of the systemization trend of chips, Siemens EDA focuses on SoC system environment verification and digital twin applications to ensure the correct operation of complex systems and quickly achieve innovation goals.

Lincoln Lee, technical general manager of Siemens EDA Asia Pacific, introduced the content of the sub-session of the summit to the guests, focusing on the innovative application of Siemens EDA in five fields: AI EDA tools, automotive chips, complex SoC, 3D IC and PCB system technology; at the same time, from Ziguang Zhanrui, ZTE Microelectronics and other experts also shared the results of cooperation with Siemens EDA, such as: how the Solido Library IP solution is based on AI technology to achieve the design goals of basic IP high performance and low power consumption, and how to automate the simulation technology solution through HyperLynx Solve the problem of high-speed signal simulation coverage, etc., explain in detail the subdivided applications in the EDA field, and promote diversified technological innovations.